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Mobile Combi-Laser MBE

MC-LMBE

Mobile Combi-Laser MBE

Combinatorial research and development by a compact, high performance, and fully PC and controlled system

The main body of the system is a UHV laser MBE apparatus to deposit thin films on a substrate by the laser abration of targets. An excimer or other pulsed laser is irradiated from outside of the UHV chamber via synthesized quartz window. Using two combinatorial masks and a scanning RHEED device,the system enables to prepare many samples at one time, each of them is controlled atomically and has a different growth condition , using a conbinatorial mask and targets irradiated by a laser in a high vaccum. The concept of the combinatorial film deposition is a systematic change of growth condition resulted by dividing a substrate by masking into many small regions having different growth parameters each other. This contributes to outstandingly rapid screening of growth conditions. A load-lock transfer componet that is a standard equipment of our MC-PLD makes exchange of targets and substrates very easy.

Specification

1. Deposition chamber

Chamber size ca. φ260mm Spherical (SUS304)
Ultimate vacuum pressure less than 6.7×10-7Pa (5×10-9Torr)
Vacuum pumping line
Main pump 250L/s TMP
Fore pump 237L/m RP
Valves CF6" manual gate valve and NW25 manual angle valve
Fore-line monitor T/C gauge
Vacuum gauges a nude ionization gauge and a capacitance manometor
Process gas inlet
Variable-leak valve
Air vant valve
φ1/4-inch nozzle facing a substrate (SUS)
Laser beam introduction port
Synthesized quartz viewing port (CF4.5")
45 degree from horizontal direction
Laser power monitor port Synthesized quartz viewing port with shutter (CF4.5")

2. Multi-target manipulator

Target loading 1inch × 3mmt × 6ea.
Target moving mechanism Z-motion : +/-20mm manual
Target rotation mechanism AC speed control motor drive
Target revolution mechanism High resolution stepping motor drive for twist motion
Mounting flange CF8", with CF2.75" viewing port for mask and substrate observation

3. Substrate heating unit

Type of substrate heating
Laser diode type
808nm, 120W (chiller included)
Substrate size 10mm square
Maximum temperature More than 1,000°C
Temperature gradient more than 200°C in one piece of substrate
Moving mechanism Z1-motion : +/- 10mm manual
Substrate rotation mechanism Stepping motor drive with sensor

4. Combinatorial mask positioning unit

Short mask mechanism X1-motion : 0 to 20mm stepping motor drive
Long mask mechanism X2-motion : 0 to 160mm stepping motor drive

5. RHEED unit and pattern processing system

Type of RHEED Parallel scanning RHEED
RHEED e-gun
Acceleration voltage : 30kV max. (25kV rated)
Mounting flange : CF1.33"
Power supply 0 to 30kV
Fluorescent screen CF6" flange mount screen for RHEED pattern observation
Scanning coil Focusing / Scanning coils for area scan of whole substrate surface
Differential pumping
Main pump 77L/s TMP
Valves CF1.33" manual angle valve and NW16 manual angle valve
Pattern processing system High resolution CCD camera unit, shade, pattern processing software

6. Load-Lock (L/L) chamber with transfer mechanism

Chamber size φ114mm Cylindrical horizontal (SUS304)
Ultimate vacuum pressure less than 6.7×10-5Pa (5×10-7Torr)
Vacuum pumping line
Main pump 77L/s TMP
Fore pump 160L/m RP
Valves CF4.5" manual gate valve and NW25 manual angle valve
Fore-line monitor T/C gauge
Vacuum gauge a nude ionization gauge
Holder stocker Substrate ×2ea., Target ×4ea.
Sample transfer Magnetic coupled transfer rod with tilt mechanism
Gate between L/L and deposition chamber CF4.5" manual gate valve

7. Common System

Frame and rack Chamber frame integrated with power supply and control rack (JIS conformity)
LMBE Control
Systematic and fully control by LMBE control software installed in PC
  • Substrate heating control
  • Ablation laser oscillation control
  • Target selection, target spin and twist control
  • Combinatorial mask position control
  • Substrate rotation control
  • Vacuum pump control

8. Utilites

AC200-240V 3φ 100A
AC200-240V 1φ 10A
O2gas, N2gas
Compressed air : Not necessary
Cooling water : Not necessary
Any construction of laboratory room is not included.
Gases for vent and process are not included.
Specifications many subject to change for improvement without notice.

Option

  • Mass flow controller(s)
  • Ozone source (or ozonizer component)
  • Radical beam source
  • Laser for abration ; Nd:YAG (3ω 355nm)
  • Laser for abration ; Excimer (KrF 248nm)
  • Optical component for laser beam introduction
  • Excimer laser stand and laser optics with protection hood
  • Pre-annealing heater in Load-Lock chamber
  • Gate valve for laser beam introduction viewing port exchange
  • Pneumatic valves, solenoid valves and control software for electronic control

News

November, 2012
Pascal Co., Ltd. builds the Ibaraki Factory at Naka-city Ibaraki Japan.
September, 2010
Pascal Co., Ltd. introduces TOFLAS-3000; the New Surface Analysis Solution using Atom Scattering Spectroscopy.
April, 2008
Pascal Co., Ltd. starts to produce Cryo Cooler Series for optical, electrical or hall effect measurements.
Febrary, 2008
Pascal Co., Ltd. builds the New Head Office and moves there
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