1. Deposition chamber

Chamber size	φ300mm × H500mm Cylindrical horizontal (SUS304)
Ultimate vacuum pressure	less than 6.7×10-7Pa (5×10-9Torr)
Vacuum pumping line	Main pump 800L/s TMP Fore pump 237L/m RP Valves CF8" pneumatic gate valve and NW25 pneumatic angle valve Fore-line monitor T/C gauge
Vacuum gauges	a nude ionization gauge and a capacitance manometor
Process gas inlet	Variable-leak valve Air vant valve φ1/4-inch nozzle facing a substrate (SUS)
Laser beam introduction port	Synthesized quartz viewing port (CF4.5") 45 degree from horizontal direction
Laser power monitor port	Blank flange (CF4.5")

2. Multi-target manipulator

Target loading	1inch × 3mmt × 6ea.
Target moving mechanism	Z-motion : +/-20mm manual
Target rotation mechanism	AC speed control motor drive
Target revolution mechanism	High resolution stepping motor drive for twist motion
Mounting flange	CF8", with CF2.75" viewing port for mask and substrate observation

3. Substrate heating unit

Type of substrate heating	Halogen lamp type (chiller not included, cooling water required)
Substrate size	up to 2inch (1.5inch standard)
Maximum temperature	More than 800°C
Moving mechanism	Z1-motion : +/- 20mm manual
	Z2-motion : +/- 20mm manual
Substrate rotation mechanism	Stepping motor drive with sensor

4. Load-Lock (L/L) chamber with transfer mechanism

Chamber size	φ160mm Cylindrical horizontal (SUS304)
Ultimate vacuum pressure	less than 6.7×10-5Pa (5×10-7Torr)
Exhaust system	Main pump 77L/s TMP Fore pump 160L/m RP Valves CF4.5" pneumatic gate valve and NW25 pneumatic angle valve Fore-line monitor T/C gauge
Vacuum gauges	a nude ionization gauge
Holder stocker	Substrate ×2ea., Target ×4ea.
Sample transfer	Magnetic coupled transfer rod
Gate between L/L and deposition chamber	CF6" manual gate valve

5. Common System

Frame	Chamber frame : 1 set
Rack	Power supply and control rack (JIS conformity) : 1 or 2 set(s)
LMBE Control	Fully computer control and/or manual control Systematic and fully control by LMBE control software installed in PC Substrate heating control Ablation laser oscillation control Target selection, target spin and twist control Substrate rotation control Vacuum pump and valve control Electronic manual controller Substrate heating control Target selection Target spin control Substrate rotation control Vacuum pump and valve control

6. Utilites

Specifications many subject to change for improvement without notice.

AC200-240V 3φ 100A O2gas, N2gas Compressed air : 0.5 MPa (5 kg/cm2) of Nitrogen or air with pressure regulator Cooling water : water pressure : more than 2kgf/cm3, water flow : more than 20L/min Any construction of laboratory room is not included. Gases for vent and process are not included.

• RHEED with single-stage differential pumping unit
• RHEED with double-stage differential pumping unit
• Parallel scanning RHEED unit
• RHEED pattern processing system
• Combinatorial mask positioning unit
• Mass flow controller(s)
• Ozone source (or ozonizer component)
• Radical beam source
• Laser for abration ; Nd:YAG (3ω 355nm)
• Laser for abration ; Excimer (KrF 248nm)
• Optical component for laser beam introduction
• Excimer laser stand and laser optics with protection hood
• Pre-annealing heater in Load-Lock chamber
• Gate valve for laser beam introduction viewing port exchange
• Synthesized quartz viewing port with shutter for laser power monitor port